HY234 Thermal Putty 10g - High Performance Thermal Interface Material for Electronics & PC Heat Sinks
PRODUCT CODE: NZHY234-10GHY234 Thermal Putty 10g.
*Important. Please note this is currently an Indent item. Delivery is typically 10~15 working days. Learn more at www.techexpress.co.nz/indent
The HY234 Thermal Putty 10g is a high-performance thermal interface material designed to improve heat dissipation in electronic devices. It is commonly used in applications where efficient thermal conductivity is essential, such as in CPUs, GPUs, heatsinks, LEDs, and other electronic components. This thermal putty is valued for its ease of application, high thermal conductivity, and stability under varying temperatures.
Applications:
• Applications for HY234 Thermal Putty 10g.
• CPU Cooling (Most Searchable) - Primary function is transferring heat from CPUs.
• GPU (Graphics Processing Unit) Cooling - Used to dissipate heat from graphics cards.
• LED Chipset Cooling - Helps manage heat generated by LED components.
• Playstation/Xbox Thermal Paste Replacement - Used for console repairs.
• Other Electronic Component Cooling - Applicable to various electronic components.
Features:
• High thermal conductivity.
• Stable performance under varying temperatures.
• Easy to apply and remove.
• Non-electrically conductive.
• Long-term reliability.
• Excellent gap filling properties.
• Low thermal resistance.
• Suitable for a wide range of applications.
Specifications:
Size: 10g.
Colour: Pink.
Sold as: Each.
Packaging: Bulk.
Volume: 10 grams.
Viscosity: 300 Pa s.
Gravity: >2.63 g/cm3.
Product Type: Thermal Paste.
Thermal conductivity: >4.0 W/m-K.
Thermal Impedance: <0.126 °C-in2/W.
Thixotropic Index: 280±10 1/10mm.
Operation Temperature(Peak): -30~240 °C.
Product Category: Computers & Tablets > Components > Processors > Thermal Paste.
Package includes: 1x 10g HY234 Thermal Putty.
*The image is for illustrative purposes only. Due to camera, lighting, monitor and manufacturing variations, colours may vary.
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Questions & Answers:
Frequently Asked Questions:
Q. What is HY234 Thermal Putty 10g used for? A. HY234 Thermal Putty 10g is a high-performance thermal interface material used to enhance heat dissipation in electronic components such as CPUs, GPUs, heatsinks, LEDs, and power electronics.
Q. How do I apply HY234 Thermal Putty? A. To apply HY234 Thermal Putty, clean the surfaces of the components, apply a small amount of putty, and spread it evenly to cover the entire surface. Ensure a thin, uniform layer for optimal thermal conductivity.
Q. Is HY234 Thermal Putty electrically conductive? A. No, HY234 Thermal Putty is not electrically conductive. It is designed to provide excellent thermal conductivity while preventing electrical shorts.
Q. What is the thermal conductivity of HY234 Thermal Putty? A. The thermal conductivity of HY234 Thermal Putty is 4.5 W/mK, making it highly effective in transferring heat away from critical components.
Q. Can HY234 Thermal Putty be used in high-temperature environments? A. Yes, HY234 Thermal Putty is suitable for use in high-temperature environments, with an operating temperature range of -50°C to 200°C.
Q. How long does HY234 Thermal Putty last? HY234 Thermal Putty has a long shelf life of 2 years and provides reliable performance over time, ensuring effective thermal management for your devices.
Q. Is HY234 Thermal Putty easy to remove? A. Yes, HY234 Thermal Putty can be easily removed by gently scraping it off the surfaces. It does not harden, making the removal process straightforward.
Q. Can I use HY234 Thermal Putty for DIY electronics projects? A. Absolutely! HY234 Thermal Putty is ideal for DIY electronics projects, providing efficient heat dissipation for various components and ensuring optimal performance.
Q. What is the viscosity of HY234 Thermal Putty? A. The viscosity of HY234 Thermal Putty is 2000-2500 Pa·s, allowing it to fill gaps effectively and maintain good thermal contact between surfaces.
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